Data Centre Cooling Zone — ALE 2026
Next-Gen Dielectric Fluids
& Immersion Cooling
The thermal side of AI infrastructure.
Next-generation AI accelerators are specified above 1,000W TDP per chip. Air is out of headroom. The Data Centre Cooling Zone at ALE 2026 puts single-phase and two-phase immersion cooling, dielectric fluids, and the chemistry behind them on one floor — three days, live demos, no sales theatre.
Why this zone exists
The thermal envelope is closing.
Malaysia and the wider ASEAN corridor are in the middle of a hyperscale build-out. The fluids that will cool it are formulated, blended, and qualified by the industry that meets at ALE.
See the 3-day programme1,000W+ per chip.
Next-generation AI accelerators carry thermal design power beyond 1,000W per package. Multiply by eight per node, and per-rack heat loads that were 10kW a decade ago are now specified at 100kW and above.
Air has a ceiling.
Past a certain rack density, air cooling stops being an engineering choice and becomes a physical limit. Direct-to-chip and immersion approaches move heat in liquid, where it belongs.
The fluid is the product.
Single-phase and two-phase immersion both live or die on fluid chemistry: dielectric strength, thermal stability, material compatibility with polymers, gaskets, and optics, and long-term chemical stability under load.
PUE is now a design input.
Operators are specifying power usage effectiveness targets at design time. Liquid cooling is one of the few levers that moves both PUE and rack density in the right direction.
Inside the Cooling Zone
Hardware in tanks. Chemists in the room.
Live immersion demos
Single-phase and two-phase immersion systems running on the floor, all three days. See fluid behaviour, serviceability, and hardware handling up close.
- Working systems
- All 3 days
- Free access
Dielectric & thermal fluids
Fluid producers and formulators showing dielectric coolants, heat-transfer fluids, and the material-compatibility data behind them. Talk to the people who run the compatibility tests.
- Fluid chemistry
- Material compatibility
- Direct R&D access
Case studies & briefings
Operator case studies and data centre buyer briefings on Days 2–3: deployment experience, failure modes, and qualification workflows — not product pitches.
- Deployment experience
- Technical sessions
- Q&A format
Business matching
Pre-scheduled one-on-one meetings matched by category and region. 640+ meetings facilitated in 2025. Visitor matching opens July 15, 2026 — up to 20 meetings.
- Pre-qualified meetings
- Private booths
- Opens July 15
Programme
Three days on the floor.
Sep 8 — Opening Day
08
- Cooling Zone grand opening
- Opening ceremony & keynote
- Pocket Talks 13:30–17:00
- Happy Hour
Sep 9 — Technical Day
09
- Data centre buyer briefings
- Cooling Zone case studies
- Learning Hub workshops*
- Happy Hour
Sep 10 — Close
10
- Cooling Zone case studies
- Career Fair
- Closing Pocket Talks
- Exhibition closes 16:00
* Learning Hub is ticketed separately. Everything else in the Cooling Zone is free with visitor registration.
Who this is for
Bring the whole thermal team.
Registration is free and covers all zones, all stages, and every demo — Sep 8–10 at MITEC Hall 1, Kuala Lumpur.
Call for speakers
Present your work.
We are assembling the Cooling Zone technical programme: case studies, deployment retrospectives, fluid qualification work, and thermal design talks. If you run immersion in production, formulate dielectric fluids, or benchmark liquid cooling — propose a session. Engineering content only; vendor pitches will be redirected to the exhibition floor.
20–30 minute sessions · Sep 8–10, 2026 · MITEC Kuala Lumpur
Building immersion systems or dielectric fluids?
Exhibit inside the Data Centre Cooling Zone — shared floor with Asia's fluid supply chain and 2,000+ trade visitors from 28 countries.